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PCB FAB CAPABILITY
1. NO. LAYER--2-24 (Batch Process)-2-24 (Sample Board)
2 .FINISHED BOARD SIZE (MAX) 23inch X 41inch (584.2mm X1041.4mm)
3 .FINISHED BOARD SIZE (MIN) 1inch X 1.2inch(25.4mm X 30.48mm)
4. BOARD THICKNESS (MAX) 0.236inch (6.0mm)
5 .BOARD THICKNESS (MIN) 0.016inch (0.40mm)
6 .T/C THICKNESS 0.0039inch (0.10mm)
7 .FINISHED BOARD THICKNESS TOLERANCE(BOARD THICKNESS ≧0.8mm) +/-10%
8. FINISHED BOARD THICKNESS TOLERANCE(0.4mm≦BOARD THICKNESS<0.8mm) +/-3mils(+/-0.075 mm)
9. WARPAGE (MAX) 0.5%
10. DRILLED HOLE DIAMETER (MAX) 6.70mm
11. DRILLED HOLE DIAMETER (MIN) 0.1mm
12. FINISHED HOLE DIAMETER (MIN) 0.075mm
13 .OUTER LAYERBASE COPPER THICKNESS (MIN) 1/3 oz (0.012mm)
14. OUTER LAYERBASE COPPER THICKNESS (MAX) 6 oz (0.21mm)
15. INNER LAYER BASE COPPER THICKNESS (MIN) 0.5 oz (0.017mm)
16. INNER LAYER BASE COPPER THICKNESS (MAX) 6 oz (0.21mm)
17. INNER LAYER DIELECTRIC THICKNESS (MIN) 0.0039inch (0.10mm)
18. DIELECTRIC MATERIAL (MIN) CEM-3 FR4(130℃ Tg)Rogcrs4003 FR4(140℃ Tg)FR4(150-170℃ Tg)
19. HOLE PLATING ASPECT RATIO (MAX) 8:01:00
20. HOLE DIAMETER TOLERANCE (PTH) +/-3mils(Batch Process)
21. HOLE DIAMETER TOLERANCE (NPTH) +/-2mils(Batch Process)
+/-1mils(Special Requirement)
22. OUTER LAYER LINE WIDTH/SPACING (MIN)T/T oz is 4mil/4mil(T 1/3 oz)H/H oz is 4mil/5mil 1/1 oz is 6mil/6mil 2/2 oz is 7mil/7mil2/2 oz is 7mil/7mil
23. INTER LAYER WIDTH/SPACING (MIN) H/H oz is 4mil/4mil1/1 oz is 4mil/4mil 2/2 oz is 6mil/6mil 3/3 oz is 6mil/6mil
24. SOLDERMASK THICKNESS (MIN) 10 um
25. SOLDERMASK DAM (MIN) 3mil (0.076mm) (C7)2.5mil(0.0635mm)(k-3ID 780 5600)
26 .SOLDERMASK PLUG HOLD DIAMETER ≧0.75mm Hole Soft Soldering0.55mm-0.75mm Single-face Tin Bead≦0.55mm No Tin Bead
27. IMPEDANCE TOLERANCE (MIN) +/-10%
28 .Surface Processing
1. Hot Air Leaving
2. Immersion Gold
3. Deposited Nickel/Gold
4. OSP
29. THERMAL STRESS TEST 288℃ 10 sec One Shot
30. FLAMMABILITY 94V-0
31. IONIC CONTAMINATION ≦10ug/in2 (≦1.55ug/mm2)
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SMT加工生產工藝，PCB ASSEMBLY CAPABILITY:
1. Single and double sided SMT/PTH
Yes
2. Large parts on both sides, BGA on both sides
Yes
3 .Smallest Chips size
0201
4 .Min BGA and Micro BGA pitch and ball counts
0.008 in. (0.2mm) pitch, ball count greater than 1000
5. Min Leaded parts pitch
0.008 in. (0.2 mm)
6. Max Parts size assembly by machine
2.2 in. x 2.2 in. x 0.6 in.
7 .Assembly surface mount connectors
Yes
8 .Odd form parts:
LED
Resistor and capacitor networks
Electrolytic capacitors
Variable resistors and capacitors (pots)
Sockets
Yes，Assembly by hands
9. Wave soldering
Yes
10. Max PCB size
14.5 in. x 19.5 in.
11. Min PCB Thickness
0.02
12 Fiducial Marks
Preferred but not required
13. PCB Finish:
1．SMOBC/HASL
2．Electrolytic gold
3．Electroless gold
4．Electroless silver
5．Immersion gold
6．Immersion tin
7．OSP
14. PCB Shape
Any
15. Panelized PCB
1．Tab routed
2．Breakaway tabs
3．V-Scored
4．Routed+ V scored
16. Inspection
1．X-ray analysis
2．Microscope to 20X
17. Rework
1．BGA removal and replacement station
2．SMT IR rework station
3．Thru-hole rework station
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